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Embedded PC ABOX-5211(P) for AMR/EV fleet management

Embedded PC ABOX-5211(P) for AMR/EV fleet management

10th generation Core i9/i7/i5/i3/Celeron CPU, extended temperature -40 to 70℃, wide DC input 9 to 60V.

**Features of SINTRONES ABOX-5211(P)** ■ Dimensions: 242mm (W) x 85mm (H) x 240mm (D), 4.94 liters ■ Fanless operation with Comet Lake 10th generation Core i9 / i7 / i5 / i3 / Celeron CPU ■ DDR4-3200MHz (up to 64GB) ■ 4K resolution support, 2 display outputs (DP) ■ 2 Mini PCIe expansion slots, 2 M.2 expansion slots ■ 2.5" HDD front access (Hot Swappable, RAID 0, 1, 5) ■ 3 M.2 M Key 2280 NVMe SSD ■ 8 GbE (1 iAMT), 8 USB3.2, 4 COM, 1 DIO ■ Extended temperature range -40 to 70°C ■ Wide DC input 9 to 60V, controlled by ignition key ■ Internal battery UPS can be installed (optional)

  • Industrial PCs
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Core 200S Embedded PC for Edge AI DLAP-4100

Core 200S Embedded PC for Edge AI DLAP-4100

DLAP series for edge AI, equipped with 2nd generation Core 200S/14th generation CPU, capable of supporting PEG graphics cards.

**ADLINK DLAP-4100 Series Features** ■ Width 230 × Height 150 × Depth 300 mm, 10.35 liters ■ 2nd Generation Core 200S / 14th/13th/12th Generation Core i9/i7/i5/13 CPU ■ Memory DDR5 SO-DIMM (up to 64GB) ■ Supports NVIDIA RTX4000 Ada PEG cards ■ Display 2 HDMI, 1 DP ■ I/O Connectors 1 2.5GbE, 1 GbE, 4 USB3.2 (Gen2), 2 USB2.0, 2 COM ■ 1 PCIe [x16] expansion slot

  • Embedded Board Computers
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  • Other server related
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15th Generation CPU Equipped Industrial Embedded PC DLAP-8000

15th Generation CPU Equipped Industrial Embedded PC DLAP-8000

DLAP series for edge AI, equipped with 15th/14th/13th generation CPU, capable of supporting PEG graphics cards.

【ADLINK DLAP-8100 Features】 ■ Width 210 × Height 350 × Depth 210 mm ■ Intel 12th to 15th generation Core 35W/65W (LGA1700) CPU ■ Memory DDR5 4800MHz (4x SODIMM slots) (up to 192GB) ■ Display supports 2×DP++, 2×HDMI ■ I/O connectors 3x 2.5GBE, 4×COM, 8×DI, 8×DO, 4×USB3.2, 2×USB3.1 ■ Expansion slots support 1x PCIe Gen4 x16 (2-slots), 1x PCIe3.0 x1, 2x PCIe3.0 x8 (Signal x4) ■ Operating temperature -20 to 60°C (without PEG card)

  • スクリーンショット 2025-08-22 175732.png
  • Embedded Board Computers
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AI Module Embedded PC for Drones IBOX-604-G2

AI Module Embedded PC for Drones IBOX-604-G2

SINTRONES, NVIDIA Jetson Orin NX/Nano module, extended temperature, for drones, lightweight and compact design

【SINTRONES IBOX-604-G2 Features】 ■ Width 120 × Height 32 × Depth 115 mm ■ NVIDIA Jetson Orin NX/Orin Nano CPU module, fanless operation ■ 16GB/8GB LPDDR5 (Orin NX CPU module)/8GB LPDDR5 (Orin Nano CPU module) ■ 1 display output (HDMI2.1) (3840x2160@30Hz) ■ 1 x M.2 3042/3052 Key B, 1 x M.2 2230 Key E expansion slots ■ 1 x 2.5GbE (Intel I226-IT), 1 x GbE (NVIDIA SoM), 2 x GMSL-2, 1 COM, 1 GPIO, 2 x USB 3.2, 1 x DI, 1 x DO ■ Supports CAN FD / RS-232 / UART for drone system communication ■ Compatible with high-precision GNSS modules or other peripherals ■ Built-in 3-axis accelerometer ■ Extended temperature range -25 to 50°C (with airflow, 0.6m/s) ■ Wide DC input 10 to 60V

  • スクリーンショット 2026-01-29 170319.png
  • スクリーンショット 2026-01-29 170325.png
  • Industrial PCs
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Core 200S Embedded PC for Edge AI DLAP-5200

Core 200S Embedded PC for Edge AI DLAP-5200

DLAP series for edge AI, equipped with 2nd generation Core 200S/14th generation CPU, capable of supporting MXM graphics modules.

**ADLINK DLAP-5200 Series Features** ■ Dimensions: 240mm (W) x 125mm (H) x 210mm (D), 6.3 liters ■ 2nd Generation Core 200S / 14th/13th/12th Generation Core i9/i7/i5/13 CPUs ■ Memory: DDR5 SO-DIMM (up to 196GB) ■ ADLINK MXM 3.1 Graphics Module Support (Type A/B) ■ Display: 6 or 3 DP, 2 HDMI ■ I/O Connectors: 6 or 3 2.5GbE, 4 USB3.2 (Gen2), 2 USB3.1 (Gen2), 3 or 2 COM ■ Expansion Slots: M.2 2280 M-key x 1, M.2 2230 E-key x 1 ■ Operating Temperature: DLAP-5200-3DP: -20 to 50°C (35W CPU) DLAP-5200-6DP: -20 to 40°C (65W CPU)

  • スクリーンショット 2026-10-05 173310.png
  • Embedded Board Computers
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  • Embedded PC for

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